Engineering Physics Second Edition

This book is intended as a textbook for the students of engineering physics and science. As an experienced teacher of physics/engineering physics. I have tried to select and arrange the material in such a way that the students would not face any difficulty in following the book. This edition, the second has been thoroughly revised. Errors and misprints have been corrected and some diagrams have been modified and improved for proper representation of the theory. To fulfil the requirements of students (on the basis of all India Survey), some more topics have been included in the second edition. New topics including conductivity of metal and semiconductor. Hall effect, magnetic materials, polarisation, zone plate, electro-optic effect, photoelasticity, etc. have been added.

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Related Papers

IEEE Transactions on Education

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International Journal of Trend in Scientific Research and Development (ijtsrd),

Effect of Hall is the most applied issue in materials science. The purpose of this paper is to investigate the effect of Hall on conductive metals such as silver, copper, and tungsten. Dimensions of the copper sheet (83mm × 25mm × 20μm) and dimensions of the silver sheet (25mm × 83mm × 43μm) and dimensions of the tungsten sheet (82mm × 20mm × 30μm) were investigated, as a result, the Hall voltage sign was positive in silver and tungsten and negative in copper. The reason for the negative sign of Hall voltage in silver and tungsten is that the hole carriers overcome the electron carriers and in copper, the electron carriers overcome the hole carriers. Due to the magnetic field of 200mT, then the Hall constant is 8 × 10 −3 for silver and −6.56 × 10 −3 for copper. According to the symbol, the constant of Hall in silver and tungsten are p-type and for copper is n-type. Also, due to the current passing through the semiconductor in the amount and changing the magnetic field for the silver and copper samples, the Hall constant is obtained 7.84 × 10 −3 and − 7.24 × 10 −3 , respectively. The carrier densities are 7.89 × 10 20 1 3 for silver and 9.06 × 10 20 1 3 for copper obtained.

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